On June 3, 2024, Sansera Engineering Limited informed in an exchange filing that the Group’s company, MMRFIC Technology Private Limited (MMRFIC), inaugurated a new Research and Development (R&D) facility in Bangalore. The facility integrates semiconductor packaging, precision printed circuit board (PCB) assembly, and the testing and qualification of in-house developed products, marking a strategic diversification in its product development range.
The company stated that with an investment outlay of US$ 4 million, MMRFIC’s new unit is being developed in phases.
The first phase, spanning 14,000 sq.ft., is now operational. It features an ISO Class 10,000 cleanroom dedicated to semiconductor packaging, handling die-attach, bonding, and sealing. Additionally, the facility includes a fully automated precision Surface-mounted device (SMD) assembly unit equipped with jet printing pick-and-place machinery, a 10+3 zone oven with nitrogen integration, and other advanced equipment. This operational facility enables production-scale integration of miniaturised Systems in Packages (SiP) and commercial off-the-shelf components (COTS).
The new facility also facilitates the strategic integration of 3D semiconductor packaging, PCB design and assembly, SiP design, functional testing, and supply chain management for comprehensive product development, all in one place. Further, it provides failure analysis support for clients globally. It is supported by a dedicated team of engineers across different functions.
Speaking of this development, the CEO, Mr Saravana Kumar, said, “We are thrilled to announce the grand opening of fast-growing Semiconductor Packaging and Assembly manufacturing at MMRFIC. This strategic move aligns with our vision to become a key player in the semiconductor value chain going forward.”
He further added, “The investment from Sansera Engineering Limited is a strong validation of our capabilities and growth potential in this space. Their support will be instrumental in serving the rising demand for advanced packaging solutions. By leveraging our expertise in this space and Sansera’s valuable industry connections, we are confident of our ability to deliver cutting-edge packaging, assembly, and test services to semiconductor companies worldwide. This venture marks an exciting chapter for MMRFIC and we look forward to contributing to the technological advancements shaping our increasingly connected world.”
Disclaimer: This blog has been written exclusively for educational purposes. The securities mentioned are only examples and not recommendations. It is based on several secondary sources on the internet and is subject to changes. Please consult an expert before making related decisions.
Published on: Jun 4, 2024, 6:01 PM IST
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